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Ars Technica·3 min read

Intel is going all-in on advanced chip packaging

Intel invests heavily in advanced chip packaging technology.

Intel is making a significant push into advanced chip packaging, revitalizing its Fab 9 facility in New Mexico after years of dormancy. With a $500 million boost from the US CHIPS Act, Intel aims to compete with TSMC in this growing sector, particularly as demand for custom chips surges due to AI advancements. The company is also in discussions with major clients like Google and Amazon to secure contracts that could enhance its revenue prospects.

Key Takeaways

1.
Intel's advanced packaging revenue projections have increased to over $1 billion.
2.
The company is in talks with Google and Amazon for packaging services.
3.
Intel's new EMIB-T technology promises improved power efficiency and signal integrity.

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